Teledyne FLIR OEM, part of Teledyne Technologies, has announced it was selected to support the US Army’s Delivering Unmatched Thermal Capability Hastened (DUTCH) initiative.
The initiative is led by the Office of the Assistant Secretary of War for Critical Technologies and the US Army Combat Capabilities Development Command (DEVCOM) C5ISR Center, to enhance next-generation uncooled thermal infrared (IR) sensing for defence applications.
“Teledyne FLIR OEM is proud to contribute to the US Army’s efforts to accelerate next-generation uncooled thermal performance while strengthening a secure, resilient domestic industrial base,” president of Teledyne FLIR OEM, Paul Clayton, said.
“Our ability to deliver state-of-the-art, NDAA-compliant thermal imaging solutions on time and at scale helps reduce program risk and ensure reliable long-term access for critical defense programs, like Drone Dominance.”
The DUTCH initiative is focused on strengthening US thermal sensor capabilities. The program will focus on improving uncooled thermal sensor performance while reducing size, weight, power, and cost (SWaP-C).
The initiative also emphasises scaling these technologies for high-volume production to enable future defence programs. Uncooled thermal sensors are essential technologies for a variety of defence applications, including uncrewed aerial systems, loitering munitions, thermal binoculars, and weapons sights.
“A trusted, scalable, and resilient domestic supply of high-performance thermal imaging camera modules is vital to US national security,” President and Chief Executive Officer of Teledyne Technologies, George Bobb, said.
“Across Teledyne, we are committed to moving quickly to develop and deliver the critical defense technologies needed by our war fighters.”
Under the award, Teledyne FLIR OEM will further the development of uncooled thermal imaging technologies and apply its system integration expertise to help drive development and demonstration efforts aligned with US Army modernisation priorities.
The work builds on the company’s continued investment in advanced small-pixel pitch uncooled thermal architectures and recent product innovations that scale integration across defence and uncrewed missions.
The DUTCH initiative aligns with the US Department of War's priorities to strengthen secure microelectronics supply chains and restore domestic manufacturing capacity for mission-critical technologies.